What are the characteristics of ceramic substrate

Ceramic substrate refers to copper foil bonded directly to alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate surface (single or double sided) at high temperature on the special process plate. The ultrathin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent soft brazing and high adhesion strength, and can be etched out of a variety of graphics like PCB board, with great current carrying capacity. Therefore, ceramic substrate has become the basic material of high power electronic circuit structure technology and interconnect technology.

Ceramic substrate Features:

◆ Strong mechanical stress, stable shape; High strength, high thermal conductivity, high insulation; Strong binding force and corrosion resistance.

◆ Good thermal cycle performance, cycle times up to 50,000 times, high reliability.

◆ As well as PCB board (or IMS substrate) can be etched out of a variety of graphic structure; Pollution-free, pollution-free.

◆ Use temperature wide -55℃ ~ 850℃; The thermal expansion coefficient is close to silicon, simplifying the power module production process.